IEEE EDAPS Conference at WTC
14th Dec 2014
The Institute of Electrical and Electronics Engineers (IEEE) Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, one of the main events in the Asia Pacific region of IEEE was supported by WTC Bangalore which was organized between 14-16 December, 2014. The symposium was focused on the electrical design of chip, package and systems for electronics applications. The symposium had over 140 participants representing 13 countries. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements. The symposium consisted of keynote and invited talks from experts, paper presentations, industry exhibition, tutorials and an informal social setting for networking.